G-10, FR-4 |
PREPREG G-10, FR-4 |
COPPER-CLAD LAMINATE FOR MULTILAYER PCB G-10, FR-4
Laminate type |
Composition |
Operating temperature range , оС |
Applications |
Dimensions |
G-10 |
Woven Glass C
loth;
|
From minus 60 to plus 110 |
Used for printed circuit boards, the manufacture of cosumer appliances, industrial equipment, computers.
|
Sheets size
:
|
FR -4 |
Woven Glass C
lot;
|
From minus 60 to plus 130 |
Sheets size:
|
NEMA
-L1 1-1989 |
G-10 |
FR-4 |
||||
IPC 4101 |
L 20 |
L 21 |
||||
Property |
Test1 method |
Unit |
Values |
|||
Requirement |
Typical2 |
Requirement |
Typical2 |
|||
Peel strength, minimum |
2.4.8 |
Kg/M |
||||
A. After thermal stress |
80 |
180 |
80 |
180 |
||
B. At
125°С |
- |
170 |
70 |
170 |
||
C. After process solutions |
- |
170 |
55 |
170 |
||
Volume Resistivity, minimum |
2.5.17.1 |
MOm·cm |
||||
A. С-96/35/90 |
1
×106 |
1
×109 |
1
×106 |
1
×108 |
||
B. After moisture resistance |
- |
- |
- |
- |
||
C. At elevated temperature E-24/125 |
1
×103 |
5
×105 |
1
×103 |
5
×105 |
||
Surface Resistivity, minimum |
2.5.17.1 |
MOm |
||||
A. С-96/35/90 |
1
×104 |
5
×106 |
1
×104 |
5
×105 |
||
B. After moisture resistance |
- |
- |
- |
- |
||
C. At elevated temperature E-24/125 |
1
×103 |
5
×104 |
5
×104 |
5
×105 |
||
Moisture Absorption, maximum |
2.6.21 |
% |
0,8 |
0,.3 |
0,8 |
0.3 |
Dielectric Breakdown, minimum |
2.5.6 |
kV |
- |
- |
- |
- |
Permittivity @ 1 Mhz, maximum |
2.5.5.3 |
- |
5,4 |
4,3 |
5,4 |
4,2 |
Loss tangent @ 1 Mhz, maximum |
2.5.5.3 |
- |
0,035 |
0,17 |
0,035 |
0,015 |
Arc resistance, minimum |
2.5.1 |
Sec |
60 |
60 |
60 |
60 |
Termal stress 10 Sec@288°C, minimum |
2.4.13.1 |
|||||
A.Unetched |
Pass visual |
Pass visual |
||||
B. Etched |
Pass visual |
Pass visual |
||||
Electric strength, minimum |
2.5.6.2 |
Volts/mm |
2.90
×104 |
5.0
×104 |
2.90
×104 |
5.
×104 |
Flammability |
2.3.10 |
Sec |
||||
A.Average burn time, maximum |
- |
- |
5 |
2.5 |
||
B. Individual burn time, maximum |
- |
- |
10 |
5 |
||
Dimensional stability |
2.4.39 |
Range |
A |
A |
||
Glass transition range, minimum |
ºС |
100 - 110 |
130 - 140 |
|||
Copper foil thickness |
µm |
18; 35; 50; 70 |
18; 35 |